COB
(Chip on board)
This is a
popular module construction method for low to medium resolution
displays including segmented glass and alphanumeric display
modules. The controller / driver IC is directly placed
on to the PCB as a naked die and subsequently wire bonded
to the PCB using micro diameter gold or aluminum wires.
The entire area of the bonded IC is then encapsulated using
a thermosetting epoxy.
* Jiangmen
Yeebo Electronics & Technology Co., Ltd. currently
has 6 fully automatic COB bonding machines with monthly
output capacity of about 240,000 units.
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